Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method

In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability bumps, which plays role in mechanical support, electrical connection, signal transmission heat dissipation, determines quality packaging. Surface morphological defects are one main factors affecting closely related to materials bonding process parameters. this paper, electrodeposition preparing gold bumps is simulated at atomic scale using Kinetic Monte Carlo method. differences surface morphology roughness plated layer studied from a microscopic perspective under different deposition results show that prepared by have better conditions lower voltage, ion concentration higher plating temperature, can provide significant guidance for engineering applications.